Dec. 6 at 7:10 PM
$INTC "We do know that US customers are looking towards competitors like Intel for their advanced packaging needs, considering the supply constraints TSMC faces for CoWoS. It was reported that firms such as Microsoft, Qualcomm, Apple, and Tesla are poised to adopt Intel's EMIB and Foveros technologies as an alternative to TSMC's services. It appears that the interest influences the Taiwan giant in Team Blue's packaging solutions, which is why introducing production in Arizona is now being accelerated significantly."
https://wccftech.com/tsmc-scrambles-to-bring-advanced-packaging-to-the-us/
