Jul. 15 at 2:00 PM
$INTC
Intel may have just changed the entire turnaround narrative.
For years, Wall Street questioned whether Intel’s 18A process could compete after repeated delays. But new reports suggest yields have improved dramatically, moving from around 65% toward 85%, closing the gap with
$TSM.
At the same time, Intel’s advanced packaging performance is reportedly reaching near 98% success rates.
The biggest shift: Nova Lake production.
Intel originally planned to rely heavily on
$TSM, but now appears positioned to bring a much larger portion back in-house - reducing costs, utilizing its own fabs, and improving margins.
If execution continues, Intel could become a stronger U.S.-based semiconductor alternative.
Companies like
$AMD,
$AMZN, and
$MSFT are watching the chip supply chain closely.
This is not an overnight turnaround, but the biggest question - can Intel still manufacture leading-edge chips? - may be changing.
The next few years will decide if
$INTC can truly challenge
$TSM
