Jul. 25 at 1:47 PM
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Samsung Secures
$200-Billion Broadcom AI Chip Pact Through 2030 In Foundry Boost
Samsung Electronics has signed a semiconductor partnership with Broadcom worth over
$200 billion through 2030, expanding cooperation in AI chips, 2nm foundry manufacturing, advanced packaging, and HBM memory.
Samsung Electronics has signed a major semiconductor partnership with US chip designer Broadcom, expanding collaboration across memory chips, contract chip manufacturing, and advanced packaging in a deal expected to exceed
$200 billion by 2030.
Announced on Saturday, the agreement is expected to strengthen Samsung's position in the fast-growing artificial intelligence (AI) semiconductor market while securing long-term production commitments from one of the world's leading custom AI chip designers.