Apr. 3 at 12:52 AM
$QUBT $LITE $COHR $FN $IONQ Hybrid Integration (The Real Secret): TFLN doesn't actually have to completely replace Silicon Photonics. Through a process called wafer-level bonding, manufacturers can literally glue a microscopic thin film of Lithium Niobate directly on top of a standard, cheap silicon wafer. This means you get the ultra-cheap manufacturing routing of silicon, combined with the ultra-fast modulation engine of TFLN.
