Jul. 20 at 2:09 PM
AI infrastructure bottleneck timelines remain extended:
• ABF substrates: ~1 year
Key suppliers include Ajinomoto, Ibiden, Unimicron, Nan Ya PCB.
• HDI boards: 6+ months
Suppliers: Victory Giant, Zhen Ding, Unimicron, Compeq, Meiko.
• Multilayer boards: ~6 months
Suppliers: Victory Giant, WUS,
$TTMI, Gold Circuit Electronics.
• CCL materials: 6+ months due to severe shortages
Suppliers include Elite Material, Shengyi, TUC, ITEQ, Nan Ya Plastics, Resonac. HVLP copper foil and glass fiber suppliers remain critical.
• MLCCs, resistors, tantalum and aluminum capacitors: 15 weeks to 1 year+
Major suppliers include Murata, TDK, Samsung Electro-Mechanics, Yageo, Walsin, Kyocera/AVX,
$VSH and others.
Supply chains are still under pressure, especially for AI data center applications. Some components also serve commodity markets, so the impact varies by product type.
A useful map of where the bottlenecks are forming across the AI hardware ecosystem.
