Sep. 17 at 10:41 AM
$TSEM Tower Semiconductor, NewPhotonics begin shipping PIC optical engine chips
Tower Semiconductor and NewPhotonics announced high-volume shipment of laser-integrated serviceable optical engines designed to meet the urgent and growing demand for high-bandwidth, energy-efficient optical interconnects in artificial intelligence infrastructure. The PIC optical engine chips support OEM solutions ranging from FRO/LRO/LPO and Extra-Dense Packaged Optics pluggable transceiver modules and Near-Packaged Optics socket pluggable applications.
Shipping volume production PICs today support data rates from 800G to 1.6T, with future volume manufacturing planned at 6.4T NPO solutions suitable for scale-out and scale-up architectures. The collaboration leverages the high-volume PH18DA silicon photonics technology platform featuring heterogeneously integrated InP components enabling monolithic integration of lasers, semiconductor optical amplifiers, modulators, and photodetectors on a single photonic integrated circuit. This highly integrated, optical-domain focused approach reduces complexity and manufacturing variability to supply better yield, reliability, and time-to-market with a leading-edge photonic device.
