Jul. 6 at 3:13 PM
Here are 5 boxes that seem promising to me on the 2030 horizon:
$STMPA /
$STM — MCAP ~
$66.6B / ~€58.3B
Strategic European semiconductor player ASML. Exposure across MCUs, power semis, edge computing, silicon photonics, and growing AI infrastructure linkage. Strong automotive + industrial base with optional AI upside over time.
$MXL — MCAP ~
$8.7B
Connectivity-focused chip company enabling high-speed data movement. Exposure to data center optics, broadband, telecom, RF and mixed-signal. AI bandwidth demand between GPUs and clusters could be a key long-term tailwind.
$AMS.SW / AMS OSRAM — MCAP ~
$2B
High-risk, high-upside optical semiconductor play. Exposure to sensors, lasers, LEDs, automotive and industrial. Optionality in micro-LED, optical interconnects, and robotics sensing over the long term.
$CIEN — MCAP ~
$59.8B
Leader in optical networking. Beneficiary of AI cluster scaling and rising demand for data center interconnect. Plays the backbone layer of distributed AI infrastructure and network expansion.
$MRVL — MCAP ~
$214.8B
Key player in custom silicon, connectivity, DPUs and optical DSPs. Deep exposure to hyperscaler-driven AI infrastructure buildout and ASIC outsourcing trends. Positioned in the critical “picks and shovels” layer of AI.
Overall, this is a framework focused on structural positioning in the AI + semiconductor value chain rather than short-term cycles.
