Jul. 17 at 8:48 PM
$ATOM
The company is reportedly gearing up to produce 90,000 2nm wafers per month by 2026, a massive increase to serve its top-tier clients. Tech giants are lining up for this capacity, eager to secure the next generation of silicon for their flagship products.
"TSMC’s N2 node is its first to feature Gate-All-Around (GAA) transistors, succeeding the long-standing FinFET architecture. This new design is crucial for scaling performance and power efficiency, a non-negotiable for the future of AI.
Beyond the transistor, TSMC is also developing panel-level packaging, a technique that uses large square substrates instead of traditional round wafers. This method aims to pack more chiplets into a single module, a vital step for building the massive AI systems of tomorrow."
https://winbuzzer.com/2025/07/17/tsmc-accelerates-arizona-fab-construction-doubles-down-on-2nm-production-to-meet-ai-chip-demand-xcxwbn/
