Jul. 22 at 1:36 PM
$MRAM Second Paragraph!
Micron Technology, Inc. (MU) , the only-U.S. based memory manufacturer, announced today that it is launching the industry's highest-density, radiation-tolerant single-layer cell (SLC) NAND product. With a die capacity of 256 gigabits (Gb), this product is the first in a portfolio that will include space-qualified NAND, NOR and DRAM solutions. The product is available now and represents the first in its class to be offered by any major memory manufacturer.
The space economy is skyrocketing, fueled by rapid growth in commercial and government missions. As computing and AI evolve, demand is rising for high-performance technology capable of processing data directly in orbit. AI-enabled edge computing is transforming space operations: allowing spacecraft to analyze sensor data, detect anomalies and make decisions autonomously, reducing reliance on Earth-based systems and preserving bandwidth.
