Market Cap | 816.72M | P/E | 7.57 | EPS this Y | - | Ern Qtrly Grth | 116.40% |
Income | 2.13B | Forward P/E | 22.18 | EPS next Y | - | 50D Avg Chg | -8.00% |
Sales | 22.17B | PEG | - | EPS past 5Y | - | 200D Avg Chg | -3.00% |
Dividend | 10.00% | Price/Book | 0.03 | EPS next 5Y | 10.00% | 52W High Chg | -18.00% |
Recommedations | - | Quick Ratio | 2.55 | Shares Outstanding | 36.36M | 52W Low Chg | 28.00% |
Insider Own | - | ROA | 2.83% | Shares Float | 519.59M | Beta | 0.49 |
Inst Own | 7.56% | ROE | 8.46% | Shares Shorted/Prior | 12.31K/36.84K | Price | 22.40 |
Gross Margin | 16.92% | Profit Margin | 9.60% | Avg. Volume | 22,540 | Target Price | - |
Oper. Margin | 6.46% | Earnings Date | Aug 1 | Volume | 17,938 | Change | -1.06% |
ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in the People's Republic of China, Taiwan, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, and testing and assembly services for LCD, OLED, and other panel display driver semiconductors. Its semiconductors are used in personal computers; office automation and consumer electronics; and communications equipment applications. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
Morgan Stanley | Equal-Weight | Nov 17, 15 |